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We've seen vertically oriented transistors, now it's time for entire chips to explore the z-axis. Collaborating with Swiss research institutes EPFL and ETH Zurich, IBM has made another important step toward creating faster, higher-efficiency "3D" processors stacking their cores vertically to increase the number of interconnections and sensibly reduce heat...
Tags: 3D, Chip, Cooling, Data transfer, Electronics, IBM, Microchannel, Pump, Research
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